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| General
Information |
 Design
provides low cost, highly reliable interconnection- Ideal
for mother/ daughter board interconnections
- Mates
with both .025 square or round pins
- Vertical
or horizontal configurations
- Single
or double row
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| Features |
- Surface
mount and solder tail configurations
- Designed
for use with double-sided and multilayered PCB's
- High-temp,
plastic allows infra-red and vapor phase soldering
- .145 ±
.006 point-of-normal-force contact
- Low insertion
force design
- BeCu contacts
- Selective
gold plating
- Standoffs
- Packaging
for robotic assembly available
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| Technical
Data |
- Current
rating = 3 amp (maximum)
- Dielectric
withstanding voltage = 1000 VAC RMS (minimum)
- Insulation
resistance = 10,000 megohms (minimum)
- Contact
resistance = 30 milliohms (maximum)
- Contact
retention = 2 lbs. (minimum)
- Durability
= 200 mating cycles (minimum)
- Temperature
ranges = -65ºC to +125ºC
- Mating
force: = 4 oz./contact (maximum)
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| Test Data
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- Specifications,
prints and samples are available upon request from Teka
Customer Service.
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links below for Product Quick View
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